DIALINE offers diamond wire with outer diameter from 50um to 450um and integrated solution for technology application. The diamond wire can be classified as diamond wire for silicon squaring, silicon slicing and sapphire slicing, by different cutting material and cutting recipe. The hard and brittle materials (silicon, sapphire, magnetic materials and advanced ceramic materials etc. ) cutting technology by diamond wire can be applied in the industry such as PV, LED, consumer electronics and precision optical instrument etc.
 
The diamond wire multi-wire slicing technology has the advantages that it is with quick speed, high machining precision, low cutting loss, high efficiency, energy saving, environment friendly. The cutting speed of diamond wire is 3 times of that of traditional slurry cutting. The fixed investment of diamond wire cutting will be 50% less and the total operating cost will be 30% less than that of slurry cutting to realize the same production capacity. It makes revolutionary contribution to the energy conservation and cost reducing of PV and sapphire cutting industry.
 
The outer diameter of diamond wire will become thinner and thinner in the future. The upgraded product with improved cutting stability will enhance the cutting efficiency, reduce the operating cost, and make contribution to the pronounced economic and social benefits.